Windows 10: Intel showcases new technology at Architecture Day 2020 event

Brink · Aug 13, 2020

At Architecture Day 2020, Intel Technical Leaders Showcase New Architectures and Innovations for the Intelligent Era

At Intel, we truly believe in the potential of technology to enrich lives and change the world. This has been a guiding principle since the company was founded. It started with the PC era, when technology enabled the mass digitization of knowledge and networking, bringing 1 billion people onto the internet. Then came the mobile and cloud era, a disruption that changed the way we live. We now have over 10 billion devices connected to supercomputers in the cloud.
We believe the next era will be the intelligent era. An era where we will experience 100 billion intelligent connected devices. Exascale performance and architecture will make this intelligence available to all, enriching our lives in more ways than we can imagine today. This is a future that inspires and motivates me and my fellow Intel architects every day.

More: Architecture Day 2020 (Press Kit)

We are generating data at a faster rate than our current ability to analyze, understand, transmit, secure and reconstruct it in real time. Analyzing a ton of data requires a ton of compute. More important, for this data to help us with insights, it needs access to compute in real time, which means low-latency, close to the user. At Intel, we are on a journey to solve this exponentially hard problem.

Since the end of the Dennard scaling era, extracting the exponential value from transistor technology inspired us to look at new approaches across the whole stack. This led us to what we call our Six Pillars of Technology Innovation, which we introduced at our Architecture Day in December 2018. We believe that delivering advances across these pillars is necessary to continue the exponential essence of Mooreâs Law.

This week, at Architecture Day 2020, we showcased how we are taking this forward with a broad range of exciting new breakthroughs. We have made great progress with our diverse mix of scalar, vector, matrix and spatial architectures â designed with state-of-the-art process technology, fed by disruptive memory hierarchies, integrated into systems with advanced packaging, deployed at hyperscale with lightspeed interconnect links, unified by a single software abstraction, and developed with benchmark defining security features.

You can watch all of the Architecture Day 2020 presentations in the event press kit, but let me underscore some of the highlights.

We provided more details about our disaggregated design methodology and our advanced packaging roadmap. We demonstrated our mastering of fine bump pitches in EMIB and Foveros technologies through several product iterations in graphics and FPGAs, and on the client with Lakefield.

We also shared one of the most exciting advancements in our transistor roadmap by introducing our new 10nm SuperFin technology, a redefinition of the FinFET with new SuperMIM capacitors that enables the largest single, intranode enhancement in Intelâs history, delivering performance improvements comparable to a full-node transition and enabling a leadership product roadmap.

When we integrate our next-generation Willow Cove CPU architecture with our 10nm SuperFin technology, the result is the incredible new Tiger Lake platform. We unpacked details of the upcoming Tiger Lake system-on-chip architecture, which provides a generational leap in CPU performance, leadership graphics, leadership artificial intelligence (AI), more memory bandwidth, additional security features, better display, better video and more. I know everyone is eager for all of the details on Tiger Lake and we look forward to sharing more in the coming weeks.

In addition to Tiger Lake, we provided a deep dive into our next generation IntelÂ® Agilexâ¢ FPGA, which provides breakthrough performance per watt. In fact, we showcased two generations of disaggregated products using EMIB and shared the first results of our 224 Gbps transceivers.

We also highlighted how Intelâs Xe GPU architecture is the foundation that helps us build GPUs that are scalable from teraflops to petaflops. Xe-LP powers leadership graphics in Tiger Lake and is our most efficient microarchitecture for PC and mobile computing platforms. Xe-LP also powers our first discrete GPU in more than 20 years, codenamed DG1. This GPU is now in production. We also introduced the first IntelÂ® server GPU, powered by Xe-LP. This GPU will ship later this year and deliver class-leading stream density and visual quality for media transcode and streaming.

On the data center front, we announced that our first Xe-HP chip is sampling to customers. Xe-HP is the industryâs first multitiled, highly scalable, high-performance GPU architecture, providing petaflop-scale AI performance and rack-level media performance in a single package based on our EMIB technology. Xe-HP will leverage enhanced SuperFin technology.

And, our enthusiast and gamer friends, we heard your requests for Xe for enthusiast gaming. We added a fourth microarchitecture to the Xe family: Xe-HPG optimized for gaming, with many new graphics features including ray tracing support. We expect to ship this microarchitecture in 2021 and I canât wait to get my hands on this GPU!

On software, we have talked before about our vision for providing developers a unified, standards-based programming model across all our XPU architectures. We are executing on that vision with our oneAPI Gold release available later this year. We also announced that we are offering DG1 early access to developers in IntelÂ® DevCloud, enabling them start developing with oneAPI without need for any setups, downloads and hardware installs.

Since our last Architecture Day, we have made some big steps in memory. Most recently, as part of the 3rd Gen IntelÂ® XeonÂ® Scalable processor launch (code-named âCooper Lakeâ&#157, we announced our 2nd Gen IntelÂ® Optaneâ¢ persistent memory product (code-named âBarlow Passâ&#157. We also remain on track to move Intelâs 4-bit-per-cell QLC into production by the end of 2020.

We also took a deeper look at how we are advancing security amid a constantly evolving threat landscape. This includes the introduction of new technologies, such IntelÂ® Control-Flow Enforcement Technology, which delivers CPU-level security structures to help protect against common malware attack methods. And, we gave the first look at our longer-term vision around foundational security, workload protection and software reliability.

We have made major progress in advancing interconnect, too. Intel announced in March 2019 that it was working with the industry for broad support for Compute Express Link, designed to accelerate next-generation data center performance and to be offered in Sapphire Rapids. We have also had a significant lead with silicon photonics in terms of customer engagements, and as the data center continues its transformation, Intel is addressing their needs through leadership speeds and foundational and SmartNIC products for network processing offloads.

Our Intel fellows and architects are passionately working on technology for 2021, 2022 and beyond. We provided a glimpse into our product vision for client and data center leveraging for all six pillars and disaggregated design. Our head of Intel Labs also provided a look at where emerging research areas can get us 100x to 1000x improvements in compute efficiency, including a sneak peek at neuromorphic architectures being researched in our world-leading labs.

For decades, Intel has been at the center of the technology industry. Our products, along with those of our customers, have reshaped the way we all work, live and play. But our collective journey is far from over. I believe we are at the start of a new era, an intelligent era, an exascale for everyone era. This era will be powered by unprecedented levels of compute performance and disruptions across all Six Pillars of Technology Innovation.

Raja M. Koduri is senior vice president, chief architect, and general manager of Architecture, Graphics, and Software at Intel Corporation.
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Source: Intel Delivers Advances Across 6 Pillars of Technology, Powering Our Leadership Product Roadmap | Intel Newsroom

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Brink · Aug 13, 2020

New Intel Architectures and Technologies

At Intel’s recent Architecture Day, Raja Koduri, Intel’s senior vice president of Core and Visual Computing, outlined a strategic shift for the company’s design and engineering model. This shift combines a series of foundational building blocks that leverage a world-class portfolio of technologies and intellectual property (IP) within the company.

Architecture Day Fact Sheet: New Intel Architectures and Technologies Target Expanded Market Opportunities

This approach is designed to allow Intel to drive an accelerated pace of innovation and leadership, and will be anchored across six strategic pillars:

Process: Access to leadership process technology remains essential to building leadership products. Advanced packaging solutions will enable Intel to continue exponential scaling in computing density by extending transistor density to the third dimension.

Architecture: The future is a diverse mix of scalar, vector, matrix and spatial architectures deployed in CPU, GPU, accelerator and FPGA sockets, enabled by a scalable software stack, integrated into systems by advanced packaging technology.

Memory: High-capacity, high-speed storage is crucial for next-generation computing workloads. Intel is uniquely positioned to combine in-package memory and Intel® Optane™ technology to fill gaps in the memory hierarchy to provide bandwidth closer to the silicon die.

Interconnect: Communication scales from wireless connections for 5G infrastructure to silicon-level package and die interconnects. Only by offering a complete range of leading interconnect products enables the heterogeneous computing landscape at scale.

Security: With the emergence of new threats, Intel has all the components to build a “better together” security strategy. Intel is uniquely positioned to deliver security technologies that help improve the end-to-end and to make security advancements a key differentiator.

Software: For every order of magnitude performance potential of a new hardware architecture there are two orders of magnitude performance enabled by software. A common set of tools that can address Intel silicon for developers is critical to exponential scaling.

Q&A – RAJA KODURI

Why do you believe that in this new era of computing Intel should anchor its product and technology strategy around these six pillars?
The landscape for computing has evolved dramatically over the past decade. We operate in a world where we generate data at a faster rate than our ability to analyze, understand and help secure it. We see immense demand for computing architectures that evolve rapidly and scale exponentially. We have a bold engineering vision over the next five years to deliver 10 petaflops of compute and 10 petabytes of data within 10 milliseconds to every person in the world. We believe these six technology pillars are the key enablers for us to drive the needed product innovation to achieve this.

How do the IP and resources in the six pillars best position Intel to win and deliver differentiated products from your competitors?
When I joined Intel, I was amazed at the sheer volume and breadth of IP available to us. In nearly three decades in the industry, I’ve never seen anything like it. The scale of these resources gives us a differentiated set of technologies in each of these pillars to apply as we drive wave after wave of innovation for client, edge and cloud computing environments. I believe we are uniquely positioned to deliver leadership across all six of these pillars which provides a foundation for sustained innovation nobody else can offer.

Why did the innovation model have to change?
The world has changed and so has our business; we’ve moved to target an addressable market north of $300 billion1. The rising demand for computing provides us with a chance to change, mold and expand Intel in an unprecedented manner. We have a responsibility not only to ourselves, but also to our customers who trust us with their businesses, critical data and computing needs, to reinvent our products and strategy for developing technologies for the next decade and beyond.

How is Intel applying the model today and in the future?
We’re applying the model today across our engineering organization as we bring innovative new product and technology initiatives to the world next year and into the future. Whether it’s the advanced packaging innovation through “Foveros” logic stacking or the “One API” approach to software developers, we’re taking steps to drive sustainable new waves of innovation.

How does the shifting landscape in computing workloads impact how Intel will build its next-generation products?
The workloads associated with this computing landscape are changing. No longer do consumers or enterprise customers have simple applications that can be addressed with straightforward scalar architectures alone. Instead we see programs that are solving problems faster by integrating additional architectures from graphics processors to artificial intelligence accelerators to image processors and even adaptable designs like FPGAs powered by new memory technologies. We will combine computing and architecture innovations through high-speed interconnects with new models for software development that simplify APIs for developers and allow more performance and efficiency to be unlocked from Intel computing architectures.

How do Intel’s investments in the six pillars drive Moore’s Law-like leaps forward in user experience?
In the previous generations, the answer has been that transistor density and Moore’s Law will play the lead role to solve computing problems. But as the process node transitions have slowed from the pace of the previous decades, it is the essence of Moore’s Law that continues to provide new technologies and capabilities to meet the demands of modern computing. The message of Moore’s Law is about more than transistors alone, with the combination of transistors, architectural research, connectivity advancements, faster memory systems, and software working together to drive it forward.
Click to expand...

Source: New Intel Architectures and Technologies Target Expanded Market Opportunities | Intel Newsroom

Brink · Aug 13, 2020

New Intel Architectures and Technologies

At Intel’s recent Architecture Day, Raja Koduri, Intel’s senior vice president of Core and Visual Computing, outlined a strategic shift for the company’s design and engineering model. This shift combines a series of foundational building blocks that leverage a world-class portfolio of technologies and intellectual property (IP) within the company.

Architecture Day Fact Sheet: New Intel Architectures and Technologies Target Expanded Market Opportunities

This approach is designed to allow Intel to drive an accelerated pace of innovation and leadership, and will be anchored across six strategic pillars:

Process: Access to leadership process technology remains essential to building leadership products. Advanced packaging solutions will enable Intel to continue exponential scaling in computing density by extending transistor density to the third dimension.

Architecture: The future is a diverse mix of scalar, vector, matrix and spatial architectures deployed in CPU, GPU, accelerator and FPGA sockets, enabled by a scalable software stack, integrated into systems by advanced packaging technology.

Memory: High-capacity, high-speed storage is crucial for next-generation computing workloads. Intel is uniquely positioned to combine in-package memory and Intel® Optane™ technology to fill gaps in the memory hierarchy to provide bandwidth closer to the silicon die.

Interconnect: Communication scales from wireless connections for 5G infrastructure to silicon-level package and die interconnects. Only by offering a complete range of leading interconnect products enables the heterogeneous computing landscape at scale.

Security: With the emergence of new threats, Intel has all the components to build a “better together” security strategy. Intel is uniquely positioned to deliver security technologies that help improve the end-to-end and to make security advancements a key differentiator.

Software: For every order of magnitude performance potential of a new hardware architecture there are two orders of magnitude performance enabled by software. A common set of tools that can address Intel silicon for developers is critical to exponential scaling.

Q&A – RAJA KODURI

Why do you believe that in this new era of computing Intel should anchor its product and technology strategy around these six pillars?
The landscape for computing has evolved dramatically over the past decade. We operate in a world where we generate data at a faster rate than our ability to analyze, understand and help secure it. We see immense demand for computing architectures that evolve rapidly and scale exponentially. We have a bold engineering vision over the next five years to deliver 10 petaflops of compute and 10 petabytes of data within 10 milliseconds to every person in the world. We believe these six technology pillars are the key enablers for us to drive the needed product innovation to achieve this.

How do the IP and resources in the six pillars best position Intel to win and deliver differentiated products from your competitors?
When I joined Intel, I was amazed at the sheer volume and breadth of IP available to us. In nearly three decades in the industry, I’ve never seen anything like it. The scale of these resources gives us a differentiated set of technologies in each of these pillars to apply as we drive wave after wave of innovation for client, edge and cloud computing environments. I believe we are uniquely positioned to deliver leadership across all six of these pillars which provides a foundation for sustained innovation nobody else can offer.

Why did the innovation model have to change?
The world has changed and so has our business; we’ve moved to target an addressable market north of $300 billion1. The rising demand for computing provides us with a chance to change, mold and expand Intel in an unprecedented manner. We have a responsibility not only to ourselves, but also to our customers who trust us with their businesses, critical data and computing needs, to reinvent our products and strategy for developing technologies for the next decade and beyond.

How is Intel applying the model today and in the future?
We’re applying the model today across our engineering organization as we bring innovative new product and technology initiatives to the world next year and into the future. Whether it’s the advanced packaging innovation through “Foveros” logic stacking or the “One API” approach to software developers, we’re taking steps to drive sustainable new waves of innovation.

How does the shifting landscape in computing workloads impact how Intel will build its next-generation products?
The workloads associated with this computing landscape are changing. No longer do consumers or enterprise customers have simple applications that can be addressed with straightforward scalar architectures alone. Instead we see programs that are solving problems faster by integrating additional architectures from graphics processors to artificial intelligence accelerators to image processors and even adaptable designs like FPGAs powered by new memory technologies. We will combine computing and architecture innovations through high-speed interconnects with new models for software development that simplify APIs for developers and allow more performance and efficiency to be unlocked from Intel computing architectures.

How do Intel’s investments in the six pillars drive Moore’s Law-like leaps forward in user experience?
In the previous generations, the answer has been that transistor density and Moore’s Law will play the lead role to solve computing problems. But as the process node transitions have slowed from the pace of the previous decades, it is the essence of Moore’s Law that continues to provide new technologies and capabilities to meet the demands of modern computing. The message of Moore’s Law is about more than transistors alone, with the combination of transistors, architectural research, connectivity advancements, faster memory systems, and software working together to drive it forward.
Click to expand...

Source: New Intel Architectures and Technologies Target Expanded Market Opportunities | Intel Newsroom

Brink · Aug 13, 2020

CES 2019: Intel Showcases New Technology for Next Era of Computing

On the eve of CES, Intel leaders – Gregory Bryant, senior vice president, Client Computing Group; Navin Shenoy, executive vice president, Data Center Group; and Professor Amnon Shashua, president and CEO of Mobileye, an Intel company – took to the stage to showcase the company’s commitment to continuously improve the computing and communications foundation that will advance the way we experience the world and expand human potential.

More: Intel at 2019 CES (All Intel News)

The company made several announcements spanning PCs and new devices to diverse growth segments including artificial intelligence (AI), 5G and autonomous driving (AD). And Intel’s leaders discussed the innovation necessary across the data center, cloud, network and edge to enable the new user experiences and form factors of the future.

Intel showcased its latest Intel® Xeon® Scalable products, shipping today with advanced AI and memory capabilities, and 9th Gen Intel® Core™ desktop products. It also announced new 10nm products for PCs, servers and 5G wireless access base stations, the future of new chip designs based on its 3D packaging technology (Foveros).

Intel also spotlighted what’s possible when technologies work seamlessly together across the entire spectrum of computing. Comcast* and Intel are working together to bring the connected home to life. New initiatives with Alibaba* demonstrate how Intel AI plans to deliver athlete tracking technology during the next Olympics. Mobileye and Ordnance Survey* will bring us closer to the realization of smart cities and safer roads.

“Anyone can claim leadership in an isolated use case, but at Intel our aim is broader. The next era of computing demands innovation at an entirely different level – one that encompasses the entire ecosystem and spans every facet of computing, connectivity and more. We won’t settle for anything less.”
–Gregory Bryant
THE CHANGING FACE OF COMPUTING

Driving Innovation Across the PC Industry: Intel’s Client Computing Group is uniquely positioned to innovate across the industry because of its broad set of technologies under one roof, enabling Intel to advance the PC and deliver the foundation for the data-centric world today.

New mobile PC platform with “Ice Lake”: The vision for tomorrow’s mobile PC platform is firmly aligned with Intel’s upcoming first volume 10nm PC processor, code-named “Ice Lake.” Ice Lake brings a new level of integration with Intel’s new Sunny Cove microarchitecture, instruction sets to accelerate AI usage and a graphics engine, and Intel Gen11 graphics to improve graphics performance for richer gaming and content creation experiences. Intel’s OEM partners are expected to have new devices with Ice Lake on shelves by holiday 2019.

Project Athena: Intel also announced Project Athena, an innovation program and new set of industry specifications developed to help usher in a new class of advanced laptops designed to enable new experiences and capitalize on next-generation technologies, including 5G and artificial intelligence. From delivering the first connected PC with integrated Wi-Fi in the Intel® Centrino® platform to driving mainstream adoption of super thin and light designs, touchscreens, and 2 in 1 form factors with Ultrabook™, Intel is uniquely positioned to be the catalyst in delivering the next-gen PC experience. Combining world-class performance, battery life and connectivity in sleek, beautiful designs, the first Project Athena devices are expected to be available in the second half of this year.

“Lakefield” preview: Intel is accelerating client innovation by taking new approaches to hybrid CPU architecture and packaging technologies. At CES 2019, Intel provided a sneak peek of a new client platform, code-named “Lakefield,” featuring the first iteration of its Foveros 3D packaging technology. This hybrid CPU architecture enables combining different pieces of IP that might have previously been discrete into a single product with a smaller motherboard footprint, which allows OEMs more flexibility for thin and light form factor design. Lakefield is expected to be in production this year.

Expanding 9th Gen Intel® Core™ desktop family: Intel introduced new additions to the 9th Gen Intel Core processors that expand the family for a broader spectrum of desktop products. These processors deliver world-class performance to unlock incredible new capabilities and experiences for content creators and gamers at all levels. The first of the new 9th Gen Intel Core desktop processors is expected to be available starting this month.

Powering the Data-Centric World across the Cloud, Network and Edge: Intel’s Data Center Group is transforming industries by delivering unparalleled assets that allow customers to move, store and process massive amounts of untapped data.

At CES 2019, Navin Shenoy, Intel executive vice president in the Data Center Group, announced the Intel Nervana Neural Network Processor for Inference, which will go into production this year. Intel Corporation displays how its technology is the foundation for the world’s most important innovations and advances at CES 2019 from Jan. 8-11 in Las Vegas. (Credit: Intel Corporation)

Advancing AI: Intel announced the Intel® Nervana™ Neural Network Processor for Inference, or NNP-I. This new class of chip is dedicated to accelerating inference for companies with high workload demands and is expected to go into production this year. Facebook* is also one of Intel’s development partners on the NNP-I. Additionally, Intel is expected to have a Neural Network Processor for Training, code-named “Spring Crest,” available later this year.

10nm server processor preview: Intel demonstrated its future Intel Xeon Scalable processor based on 10nm, code-named “Ice Lake.” Compatible with the upcoming 14nm Cooper Lake, Ice Lake processors targeting server are expected to deliver performance improvements, new hardware-enhanced security features and more, with shipments targeted for 2020.

Expanding 5G with 10nm SoCs: Intel disclosed it is expanding its decadelong investment in network infrastructure with new 10nm-based network system on chip (SoC), code-named “Snow Ridge,” that has been developed specifically for 5G wireless access and edge computing. This network SoC is intended to bring Intel architecture into wireless access base stations and allow more computing functions to be distributed out at the edge of the network. Snow Ridge is expected to be available in the second half of this year.

Shipping next-generation Intel Xeon Scalable processors: Intel announced it has started revenue shipments of its next-generation Intel Xeon Scalable processors, code-named “Cascade Lake.” Cascade Lake introduces support for Intel® Optane™ DC persistent memory and Intel® DL Boost, which is designed to accelerate AI deep learning inference. Cascade Lake is expected to be broadly available in the first half of this year.

“The product, innovation and partnership announcements we’re making today highlight that Intel’s strategy is working. We are making excellent progress in pursuing a massive $300 billion data-driven market opportunity spanning the most important workloads – such as AI, 5G and autonomous driving. And on a scale unmatched by others.”
–Navin Shenoy
ENGINEERING FOR HUMAN EXPERIENCE

Intel also spotlighted what’s possible when technologies work seamlessly together across the entire spectrum of computing – from device to cloud and across the network to the edge to deliver new, immersive experiences.

Expanding the impact of automotive data: Mobileye announced an agreement with U.K. mapping agency Ordnance Survey to bring high-precision location data to improve operations between businesses and cities and bring us closer to the realization of smart cities and safer roads. Ordnance Survey’s world-leading geospatial and technology expertise will be paired with Mobileye’s automotive camera-based mapping capabilities to offer a new, highly accurate and customizable location information service to Ordnance Survey customers across energy, infrastructure and other sectors. The new service will also support 5G, intelligent mobility and additional digital services, enabling a fully connected, digital Britain.

Going for gold with AI: Intel and Alibaba announced a partnership to develop the first-ever AI-powered 3D athlete tracking technology. The technology utilizes existing and upcoming Intel hardware and the Alibaba cloud to power a computing-intensive, cutting-edge deep learning application. The combination of computer vision with AI deep learning algorithms will enable the team to extract 3D forms of the athletes in training and competition from multiple standard video cameras without the use of special sensors or suits. Intel and Alibaba, together with partners, aim to deliver this state-of-the-art tracking technology for the 2020 Olympic Games in Tokyo.

Redefining home connectivity: Intel and Comcast are laying the foundation to deliver new immersive experiences in the home. It is estimated that each person in North America will have 13 or more connected devices by 20221, and demands are increasing for high-resolution content streaming, gaming and more. The collaboration between Intel and Comcast will deliver faster speeds, more capacity and responsive networks that will bring new immersive experiences to millions of people, including during the Olympic Games Tokyo 2020. For the next wave of gigabit and beyond broadband, Intel is working with cable industry leaders on a global standard for 10 Gigabit technology and is starting to test this in lab settings. Next up, Comcast and Intel are also working together to develop Wi-Fi 6-enabled technologies.

From next-generation communications to a new era of computing, Intel technology is the foundation for the world’s most important innovations and advances.
Click to expand...

Source: 2019 CES: Intel Showcases New Technology for Next Era of Computing | Intel Newsroom

Windows 10: Intel showcases new technology at Architecture Day 2020 event

Intel showcases new technology at Architecture Day 2020 event

Intel showcases new technology at Architecture Day 2020 event

Intel showcases new technology at Architecture Day 2020 event

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